ISO 4825-1:2023
p
ISO 4825-1:2023
80379

Abstract

 Preview

This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.


General information 

  •  : Published
     : 2023-01
  •  : 1
     : 12
  •  : ISO/TC 206 Fine ceramics
  •  :
    81.060.30 Advanced ceramics

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