This document specifies a test method for plasma resistance of ceramic components in semiconductor manufacturing equipment. It is applicable to ceramic components of plasma-resistant components in dry etching chambers used in semiconductor manufacturing.
Status: PublishedPublication date: 2019-06
Edition: 1Number of pages: 4
Technical Committee: ISO/TC 206 Fine ceramics
- ICS :
- 81.060.30 Advanced ceramics
This standard contributes to the following Sustainable Development Goal:
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|std 2 40||Paper|
ISO 21859:2019Stage: 60.60
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