Resumen
ISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.
Informaciones generales
-
Estado: PublicadoFecha de publicación: 2014-05Etapa: Cierre de la revisión [90.60]
-
Edición: 1Número de páginas: 45
-
Comité Técnico :ISO/TC 61/SC 11ICS :83.180
- RSS actualizaciones